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Dell APEX Cloud Platform MC-760 Hardware Requirements and Specifications

Thermal restriction matrix

The information that is provided describes the thermal restrictions for the MC-760 system.

The following table provides information about the processor and heat sink matrix for the MC-760.

Table 1. Processor and heat sink matrixThis table provides information about the processor and heat sink matrix for the MC-760.
Heat sink Processor TDP
STD HSK ≤ 165 W (supports only 2.5-inch drives and non-GPU configuration).
2U HPR HSK 125 W–250 W (supports 3.5-inch drives and non-GPU configuration).
165 W–350 W (supports 2.5-inch drives and non-GPU configuration).
L-type HSK Supports all GPU and FPGA configurations

All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

The following table provides information about the label reference for the MC-760.

Table 2. Label referenceThis table provides information about the label reference for the MC-760.
Label Description
STD Standard
HPR (Silver) High Performance Silver (HPR) fan
HPR (Gold) High Performance Gold (VHP) fan
HSK Heat sink
LP Low profile
FH Full height

The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor supports an ambient temperature of 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).

The following table provides information about the thermal restrictions matrix for air-cooled configuration for the MC-760.

Table 3. Thermal restriction matrix for air-cooled configuration (2.5-inch fans)This table provides information about the thermal restrictions matrix for air-cooled configuration for the MC-760.
Configuration 24 x 2.5-inch SAS 24 x 2.5-inch NVMe 12 x 3.5-inch Ambient temperature
Rear storage No rear drives 4 x 2.5 in with rear fan No rear drives No rear drives 2.5-inch rear drives with rear fan
CPU TDP/cTDP T-Case max center (°C) Fan HPR GOLD fan 70%
125 W 79 STD HPR SLVR HPR GOLD HPR SLVR HPR GOLD 35°C (95°F)
150 W 72, 78, or 79 STD HPR SLVR HPR GOLD HPR SLVR HPR GOLD 35°C (95°F)
165 W 82 or 84 STD HPR SLVR HPR GOLD HPR SLVR HPR GOLD 35°C (95°F)
185 W 80, 81, or 85 STD HPR SLVR HPR GOLD HPR GOLD HPR GOLD 35°C (95°F)
195 W 96 STD HPR SLVR HPR GOLD HPR GOLD HPR GOLD 35°C (95°F)
205 W 76, 84, or 85 STD HPR SLVR HPR GOLD HPR GOLD HPR GOLD 35°C (95°F)
225 W 79 STD HPR SLVR HPR GOLD HPR GOLD* HPR GOLD* 35°C (95°F)
250 W 76 STD HPR SLVR HPR GOLD HPR GOLD HPR GOLD 35°C (95°F)
270 W 71 or 75 HPR SLVR HPR SLVR HPR GOLD N/S N/S N/S
300 W 75, 76, or 81 HPR SLVR HPR SLVR HPR GOLD N/S N/S N/S
350 W 79 HPR SLVR HPR SLVR HPR GOLD fan* N/S N/S N/S
350 W 57 or 66 N/S N/S N/S N/S N/S N/S

*Supported ambient temperature is 30°C (86°F).

The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5-inch fans) for the MC-760.

Table 4. Thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5 in fans)This table provides information about the thermal restriction matrix for memory with air-cooled configuration (non-GPU, 2.5-inch fans) for the MC-760.
Configuration No backplane 24 x 2.5-inch SAS 24 x 2.5-inch NVMe 12 x 3.5-inch
Rear storage No rear drives No rear drives 4 x 2.5-inch with rear fan No rear drives No rear drives 2.5-inch rear drives with rear fan
DIMM Configuration 2DPC/Power STD fan (CPU TDP <= 250 W) HPR SLVR fan (CPU TDP up to 350 W) HPR GOLD fan (CPU TDP up to 350 W) HPR GOLD fan 70% (CPU TDP up to 250 W)
256 GB RDIMM 12.7 W 30°C (86°F) N/A 35°C (95°F) N/A N/A N/A
128 GB RDIMM 8.9 W 35°C (95°F) 30°C (86°F) 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
64 GB RDIMM 6.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
32 GB RDIMM 4.1 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
16 GB RDIMM 3 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
DIMM Configuration 2DPC/Power HPR SLVR fan (CPU TDP up to 350 W) HPR GOLD fan (CPU TDP up to 350 W) HPR GOLD fan 70% (CPU TDP up to 250 W)
256 GB RDIMM 12.7 W 30°C (86°F) 35°C (95°F) 35°C (95°F) Not supported Not supported Not supported
128 GB RDIMM 8.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
64 GB RDIMM 6.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
32 GB RDIMM 4.1 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
16 GB RDIMM 3 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)

In a 12 x 3.5-inch drive configuration with rear modules, CPU thermal design power (TDP) greater than 270 W and specific low temperature CPUs, are not supported.

The following table provides information about the thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU) for the MC-760.

Table 5. Thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU)This table provides information about the thermal restriction matrix for rear NVMe drives with air-cooled configuration (non-GPU) for the MC-760.
Configuration 24 x 2.5 in SAS 12 x 3.5 in
Rear storage 4 x 2.5 in with rear fan 4 x 2.5 in with rear fan
Drive type Drives capacity Power HPR SLVR fan HPR GOLD fan 70%
Kioxia CD7 15.36 TB 19 W 35°C (95°F) 30°C (86°F)
Samsung PM9A3 7.68 TB 14 W 35°C (95°F) 30°C (86°F)
Samsung PM1733 15.36 TB 22 W 30°C (86°F) 30°C (86°F)
Samsung PM1733a 15.36 TB 19.7 W 30°C (86°F) N/A
Samsung PM1735a 12.8 TB 19.8 W 30°C (86°F) N/A
Intel P5520 15.36 TB 20 W 35°C (95°F) 35°C (95°F)

The following table provides information about the thermal restriction matrix for GPU configurations for the MC-760.

Table 6. Thermal restriction matrix for GPU configurationsThis table provides information about the thermal restriction matrix for GPU configurations for the MC-760.
Configuration No backplane 24 x 2.5 in SAS 24 x 2.5 in NVMe
Rear storage No rear drives No rear drives No rear drives
CPU TDP/cTDP T-Case max center (°C) HPR GOLD fan with 1U HPR L-Type HSK
125 W 79 35°C (95°F) 35°C (95°F) 35°C (95°F)
150 W 72, 78, or 79 35°C (95°F) 35°C (95°F) 35°C (95°F)
165 W 82 or 84 35°C (95°F) 35°C (95°F) 35°C (95°F)
185 W 80, 81, or 85 35°C (95°F) 35°C (95°F) 35°C (95°F)
195 W 96 35°C (95°F) 30°C (86°F) 30°C (86°F)
205 W 76, 84, or 85 35°C (95°F) 35°C (95°F) 35°C (95°F)
225 W 79 35°C (95°F) 35°C (95°F) 35°C (95°F)
250 W 76 35°C (95°F) 35°C (95°F) 35°C (95°F)
270 W 75 35°C (95°F) 35°C (95°F) 35°C (95°F)
270 W 71 35°C (95°F) 30°C (86°F) 30°C (86°F)
300 W 75, 76, or 81 35°C (95°F) 30°C (86°F) 30°C (86°F)
350 W 79 30°C (86°F) Not supported Not supported
350 W 57 or 66 Not supported Not supported Not supported

The following table provides information about the thermal restrictions matrix for air-cooled configuration (GPU) for the MC-760.

Table 7. Thermal restrictions matrix for air-cooled configuration (GPU)This table provides information about the thermal restrictions matrix for air-cooled configuration (GPU) for the MC-760.
Configuration 24 x 2.5 in SAS 24 x 2.5 in NVMe
Rear storage No rear drives No rear drives
GPU HPR GOLD fan with 1U HPR L-Type HSK
A40 (Max 2) 30°C (86°F) 30°C (86°F)
A100 80 GB (Max 2) 35°C (95°F) 35°C (95°F)
A16 (Max 2) 35°C (95°F) 35°C (95°F)
A30 (Max 2) 35°C (95°F) 35°C (95°F)
A2 (Max 6) 35°C (95°F) 35°C (95°F)
H100 (Max 2) 35°C (95°F) 35°C (95°F)
A800 (Max 2) 35°C (95°F) 35°C (95°F)

The following table provides information about the thermal restriction matrix for memory with air-cooled configuration (GPU) for the MC-760.

Table 8. Thermal restriction matrix for memory with air-cooled configuration (GPU)This table provides information about the thermal restriction matrix for memory with air-cooled configuration (GPU) for the MC-760.
Configuration No backplane 24 x 2.5 in SAS 24 x 2.5 in NVMe*
DIMM configuration 2DPC/Power HPR GOLD fan with 1U HPR L-Type HSK
256 GB RDIMM 12.7 W 30°C (86°F) Required DLC Required DLC
128 GB RDIMM 8.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F)
64 GB RDIMM 6.9 W 35°C (95°F) 35°C (95°F) 35°C (95°F)
32 GB RDIMM 4.1 W 35°C (95°F) 35°C (95°F) 35°C (95°F)
16 GB RDIMM 3 W 35°C (95°F) 35°C (95°F) 35°C (95°F)
* In 24 x 2.5-in NVMe configuration, for CPU TDP 270 W - 300 W and specific Low Temperature-case CPUs, the supported ambient temperature is 30°C (86°F).

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