way too hot 435mt

Sounds like there is not enough air flow. Just for kicks, pull the side panel off and see how much that brings the temp down if any. Then if you have a small floor/desk fan run that blowing into the open side. If that brings the temp down you made need to add a fan or two inside (intake/exhaust) or replace the two you have with higher cfm's

the cpu temps r fine i know ,the temp i am thinking is too hot is the north or south bridge (unsure what 1 is what)

and i think that 200f+ is way too hot for me

More fans do not mean lower temps, just more noise. That ABS case is the same kind of low air flow stuff that the OEMs use. Additionally, now do you know it's too hot when you don't know what the sensor is actually reading or if it was actually calibrated correctly? Those temps are not out of line (nor unsafe) for a Core i7 or even the 95w Core 2 Quads.

but how is that so if i put 3 more fans and two are running off the power supply (lol)

the side pannel off the temp goes up 2-3c

but how is that so if i put 3 more fans and two are running off the power supply (lol) the side pannel off the temp goes up 2-3c

Now add the floor fan and the temps should improve with the speed of the fan. Higher airflow = greater heat dissipation = lower temp.

More fans do not mean lower temps, just more noise. That ABS case is the same kind of low air flow stuff that the OEMs use. Additionally, now do you know it's too hot when you don't know what the sensor is actually reading or if it was actually calibrated correctly? Those temps are not out of line (nor unsafe) for a Core i7 or even the 95w Core 2 Quads.

I disagree, radiation, conduction, and convection are three ways to dissipate heat from a device. Chipset designs use heat sinks to improve heat dissipation. The thermal energy transfer efficiency of heat sinks is due to the low thermal resistance between the heat sink and the ambient air. Thermal resistance is the measure of a substance’s ability to dissipate heat, or the efficiency of heat transfer across the boundary between different media. A heat sink with a large surface area and good air circulation (airflow) gives the best heat dissipation.

I ddn't say good airflow wsan't the best way to remove heat, just that more fans do not necessarily equal better air flow.  The case the OP bought looks to have no better air flow than the stock case, so more fans do not mean better air flow so it's no shock the temps aren't radically better. Add in two unidentified sensors that may or may not be calibrated and we are way outside scientific method and just trying to guess what we are cooling and if it is effective.

Undirected air flow is worthless and adding more fans to a poorly designed case simply moves hot air around a limited space, raising temps. Additionally, cases are often designed to force air in one direction, so when you take the door off and temps go up it means you are breaking the air flow pattern and some of the hot air is now just sitting in stead of being forced out. More foced air does not always equal lower temps, but I may have said that already.

ya im thinking you are rite and yes it is very stable the only bsod or anything like that was becoz of drivers.

im gona get a fan controler for the lack of fan plugs on the mobo and i might get a chipset fan,mabie a 25 or 30mm but i think ur rite bob.

i got what u r saying bob and it does make good sence,and with that sead u are rite ;)

but it still dont solve my problem here is another pic from cpuid

http://tinypic.com/r/1tla8i/5 

the hot spot is the heatsink rite under the cpu  

http://tinypic.com/r/33otxyp/5   mobo

I was hoping you had a small desk/floor fan to blow into the opened side of the case to see if it brought the temp down. That would tell us it was an air flow problem. When I say add a fan or two, I meant replacing the ones in the case with more efficient (higher CFM'S) ones. If the desk fan didn't bring it down, then we would have to explore other avenues.

It could be as simple as no thermal paste, improperly applied thermal paste, etc.