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Dell PowerEdge FC430 Owner's Manual

General memory module installation guidelines

NOTE: Memory configurations that fail to observe these guidelines can prevent your system from booting, stop responding during memory configuration, or operating with reduced memory.

The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural configuration. The following are the recommended guidelines for installing memory modules:

  • x4 and x8 DRAM based memory modules can be mixed. For more information, see the Mode-specific guidelines section.
  • Up to three dual- or single-rank RDIMMs can be populated per channel.
  • If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or slower depending on system DIMM configuration.
  • Populate memory module sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 are available. For dual-processor systems, sockets A1 to A4 and sockets B1 to B4 are available.
  • Populate all the sockets with white release tabs first, followed by the black release tabs, and then the green release tabs.
  • When mixing memory modules with different capacities, populate the sockets with memory modules with highest capacity first. For example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white release tabs and 4 GB memory modules in the sockets with black release tabs.
  • In a dual-processor configuration, the memory configuration for each processor should be identical. For example, if you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
  • Memory modules of different capacities can be mixed provided other memory population rules are followed (for example, 4 GB and 8 GB memory modules can be mixed).
  • The memory module for DIMM sockets A3, A4, B3, and B4 need to be inserted 180° reverse with regard to the DIMMs in the sockets A1, A2, B1, and B2.
  • Mixing of more than two memory module capacities in a system is not supported.
  • Populate four memory modules per processor (one DIMM per channel) at a time to maximize performance.
Table 1. Heat sink—processor configurationsThis table describes heat sink and processor configuration supported on FC430.
Processor configuration Processor type (in Watts) Heat sink width Number of DIMMs
Maximum system capacity Reliability, Availability, and Serviceability (RAS) features
Dual processor Up to 120 W 61 mm 8 8
Single processor 140 W 96 mm 4 4
120 W 61 mm 4 4

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