NOTE: Memory configurations
that fail to observe these guidelines can prevent your system from
booting, stop responding during memory configuration, or operating
with reduced memory.
The system supports Flexible
Memory Configuration, enabling the system to be configured and run
in any valid chipset architectural configuration. The following are
the recommended guidelines for installing memory modules:
x4 and x8 DRAM based memory modules can be mixed.
For more information, see the Mode-specific guidelines section.
Up to three
dual- or single-rank RDIMMs can be populated per channel.
If memory modules
with different speeds are installed, they will operate at the speed
of the slowest installed memory module(s) or slower depending on system
DIMM configuration.
Populate memory module
sockets only if a processor is installed. For single-processor systems,
sockets A1 to A4 are available. For dual-processor systems, sockets
A1 to A4 and sockets B1 to B4 are available.
Populate all
the sockets with white release tabs first, followed by the black release
tabs, and then the green release tabs.
When mixing memory modules with different capacities,
populate the sockets with memory modules with highest capacity first.
For example, if you want to mix 4 GB and 8 GB memory modules, populate
8 GB memory modules in the sockets with white release tabs and 4 GB
memory modules in the sockets with black release tabs.
In a dual-processor configuration, the memory configuration
for each processor should be identical. For example, if you populate
socket A1 for processor 1, then populate socket B1 for processor 2,
and so on.
Memory modules of different capacities can be mixed
provided other memory population rules are followed (for example,
4 GB and 8 GB memory modules can be mixed).
The memory module
for DIMM sockets A3, A4, B3, and B4 need to be inserted 180° reverse
with regard to the DIMMs in the sockets A1, A2, B1, and B2.
Mixing of more than two memory module capacities
in a system is not supported.
Populate four
memory modules per processor (one DIMM per channel) at a time to maximize
performance.
Table 1. Heat sink—processor
configurationsThis table describes heat sink and processor configuration
supported on FC430.
Processor
configuration
Processor
type (in Watts)
Heat
sink width
Number of DIMMs
Maximum system capacity
Reliability, Availability,
and Serviceability (RAS) features
Dual processor
Up to 120 W
61 mm
8
8
Single processor
140 W
96 mm
4
4
120 W
61 mm
4
4
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