PowerEdge: Bonded Interfaces Do Not Come Online with Intel IPU E2100-CCQDA2

摘要: If a bond is created in Linux using the Intel Infrastructure Processing Unit (IPU) E2100-CCQDA2, the bond does not come online.

本文章適用於 本文章不適用於 本文無關於任何特定產品。 本文未識別所有產品版本。
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症狀

When checking the bond interface status, it shows as DOWN.

nm-bond showing down after creating it with IPU ports
 
 
 

原因

Bonds are not supported with Intel Infrastructure Processing Units (IPUs).

解析度

This is expected behavior, and bonds should not be used.

受影響的產品

Intel PRO Family of Adapters

產品

PowerEdge R660, PowerEdge R660xs, PowerEdge R6615, PowerEdge R6625, PowerEdge R760, PowerEdge R760XA, PowerEdge R760xd2, PowerEdge R760xs, PowerEdge R7615, PowerEdge R7625, PowerEdge R860, PowerEdge R960
文章屬性
文章編號: 000221411
文章類型: Solution
上次修改時間: 21 4月 2025
版本:  4
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