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Dell PowerEdge FC630 Owner's Manual

General memory module installation guidelines

Your system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset architectural configuration. The following are the recommended guidelines for best performance:

  • LRDIMMs, and RDIMMs must not be mixed.
  • x4 and x8 DRAM based DIMMs can be mixed. For more information, see the Mode-specific guidelines section.
  • A maximum of three single- or dual-rank RDIMMs can be populated in a channel.
  • Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available. For dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
  • Populate all sockets with white release tabs first, black, and then green.
  • Populate the sockets by highest capacity DIMM in the following order - first in sockets with white release levers and then black. For example, if you want to mix 16 GB and 8 GB DIMMs, populate 16 GB DIMMs in the sockets with white release tabs and 8 GB DIMMs in the sockets with black release tabs.
  • In a dual-processor configuration, the memory configuration for each processor must be identical. For example, if you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
  • Memory modules of different sizes can be mixed provided that other memory population rules are followed (for example, 4 GB and 8 GB memory modules can be mixed).
  • Depending on mode-specific guidelines, populate four DIMMs per processor (one DIMM per channel) at a time to maximize performance. For more information, see the Mode-specific guidelines section.
Table 1. Heat sink — processor configurationsThe following table describes about the Heat sink — processor configurations.
Processor Configuration Processor Type (in Watts) Heat Sink Width Number of DIMMs
Maximum System Capacity Reliability, Availability, and Serviceability (RAS) Features
Single processor 105 W, 120 W or 135 W 68 mm 12 12
Single processor 135 W (four cores, six cores, or eight cores), 145 W, or 105 W (for acoustic configuration) 104 mm 8 (Three DIMMs in channel 0 and channel 2 and one DIMM in channel 1 and channel 3) 4 (One DIMM per channel)
NOTE: When using an 104 mm wide heat sink for a single processor, the memory module sockets A6, A8, A10, and A12 are not available for population.
Dual processor 105 W, 120 W or 135 W 68 mm 24 24
Dual processor 135 W (four cores, six cores, or eight cores), 145 W, or 105 W (for acoustic configuration) 104 mm 16 (Three DIMMs in channel 0 and channel 2 and one DIMM in channel 1 and channel 3) 8 (One DIMM per channel)

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