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Dell EMC PowerEdge R750 Technical Specifications

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Thermal restriction matrix

Table 1. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR High performance
HSK Heat sink
LP Low profile
FH Full height
DW Double Wide
BPS Intel Persistent Memory 200 series (BPS)
DPC DIMM per channel
Table 2. Processor and heat sink matrixThe table describes processor and heat sink matrix:
Heat sink Processor TDP
1U STD HSK ≤ 165 W (for non-GPU)
T-Type HSK For all TDP with GPU, and 256 GB LRDIMM configurations
2U HPR HSK >165 W (for non-GPU configurations)
Table 3. Thermal restriction matrix with ≤64 GB RDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W STD fan HPR SLVR fan STD fan HPR GOLD fan HPR SLVR fan HPR SLVR fan 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W HPR SLVR fan HPR GOLD fan 30°C
195 W 35°C
205 W HPR GOLD fan 35°C
225 W 35°C
230 W HPR SLVR fan* 30°C
235 W HPR SLVR fan* 30°C
240 W HPR SLVR fan* 30°C
250 W HPR SLVR fan* 30°C
265 W STD fan HPR SLVR fan HPR SLVR fan* 30°C
270 W STD fan HPR SLVR fan 30°C
NOTE * Supported ambient temperature is 30°C.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 4. Thermal restriction matrix with 128 GB LRDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.4-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drive No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W STD fan HPR SLVR fan HPR SLVR fan HPR SLVR fan HPR GOLD fan HPR SLVR fan HPR SLVR fan* 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W HPR SLVR fan* 30°C
205 W HPR GOLD fan 30°C
225 W Not supported 30°C
230 W 30°C
235 W 30°C
240 W 30°C
250 W 30°C
265 W STD fan HPR SLVR fan Not supported 30°C
270 W STD fan HPR SLVR fan 30°C
NOTE * Supported ambient temperature is 30°C.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 5. Thermal restriction matrix with 256 GB LRDIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W 1DPC/2DPC 1DPC 1DPC Not supported 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W 30°C
205 W 30°C
225 W 30°C
230 W 30°C
235 W 30°C
240 W 30°C
250 W 30°C
265 W 30°C
270 W 30°C
NOTE For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations.
NOTE For CPU TDP >165 W and riser configuration 1, 2, 3, or 4 supports maximum of four PCIe cards in Riser 1 or 2. This restriction is applicable for 8 x 2.5-inch NVMe, 16 x 2.5-inch SAS/SATA and 16 x 2.5-inch NVMe system configurations.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 6. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU)The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W HPR GOLD fan Not supported 35°C
120 W 35°C
125 W 35°C
135 W 35°C
140 W 35°C
150 W 35°C
165 W 35°C
185 W 30°C
195 W 35°C
205 W 35°C
225 W 35°C
230 W 35°C
235 W 35°C
240 W 35°C
250 W 35°C
265 W 35°C
270 W 35°C
Table 7. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU)
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
The table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan No Rear Drives No Rear Drives No Rear Drives 2 x Rear 2.5-inch, no rear fan 4 x Rear 2.5-inch with fan
CPU TDP/cTDP 105 W HPR GOLD fan Not supported 30°C
120 W 30°C
125 W 30°C
135 W 30°C
140 W 30°C
150 W 30°C
165 W 30°C
185 W 30°C
195 W
205 W
225 W
230 W
235 W
240 W
250 W
265 W
270 W 30°C
NOTE For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch configurations.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 8. Thermal restriction with ≤128 GB DIMM (GPU)The table describes GPU thermal restriction matrix for the system.
Configuration (Front storage) Fan type CPU TDP/cTDP GPU (Ambient temperature)
A100 (80G) A100 A40 (max 2) A30 A10 M10 (max 2) T4 (max 6)
8 x 2.5-inch NVMe and No Backplane HPR SLVR fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
24 x 2.5-inch SAS HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe HPR GOLD fan 270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
24 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C 35°C 30°C 30°C 35°C 35°C 30°C
NOTE GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.
NOTE All GPU cards require 1U T-type HSK and GPU shroud.
NOTE T4 GPU is not supported on riser 2 in 8 x 3.5-inch configuration
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.
Table 9. Thermal restriction with BPS + ≤128 GB DIMM (GPU)The table describes GPU thermal restriction matrix for the system.
Configuration (Front storage) Fan type CPU TDP/cTDP GPU (Ambient temperature)
A100 (80G) A100 A30 A10 T4 (max 4) M10 (max 2) A40 (max 2)
8 x 2.5-inch NVMe and No Backplane HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
16 x 2.5-inch SAS HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
16 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C 30°C 30°C 30°C 30°C 30°C 30°C
24 x 2.5-inch SAS HPR GOLD fan 270 W Not supported 30°C Not supported
16 x 2.5-inch SAS + 8 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C
24 x 2.5-inch NVMe HPR GOLD fan 270 W 30°C
NOTE GPU cards are not supported in 12 x 3.5-inch drive and rear drive configuration systems.
NOTE All GPU cards require 1U T-type HSK and GPU shroud.
NOTE T4 GPU card is not supported in Riser 2 slots.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.

Other restrictions for air cooling configurations

  • Kioxia CM6/CD6 NVMeSSD are not supported on rear drive module.
  • Samsung 1733v2/1735v2 NVMeSSD are not supported on 12 x 3.5-inch rear drive module.
  • ICX XCC Platinum 8368Q 270W-38C CPU in air cooling system is not supported.
  • 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.
  • Requires 2U-HPR HSK(8F34X) to support "ICX HCC Gold 6334 165W-8C CPU" in non-GPU configuration.
  • Requires HPR GOLD fan to support BOSS-S1 on 2.5-inch configuration and not supported on 3.5-inch configuration.

Thermal restriction for liquid cooling systems

Table 10. Thermal restriction matrix for liquid cooling systemsThe table describes thermal restriction matrix:
Configuration 8 x 2.5-inch NVMe and No Backplane 16 x 2.5-inch SAS/SATA 16 x 2.5-inch NVMe 24 x 2.5-inch SAS/SATA 16 x 2.5-inch + 8 x 2.5-inch NVMe 24 x 2.5-inch NVMe 12 x 3.5-inch SAS/SATA
Rear storage No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives No Rear Drives
Memory 8 GB RDIMM STD fan¹ STD fan³ STD fan¹ STD fan² STD fan¹ STD fan¹ HPR SLVR fan²
16 GB RDIMM
32 GB RDIMM
64 GB RDIMM
128 GB LRDIMM STD fan¹ STD fan¹ HPR SLVR fan¹
256 GB LRDIMM HPR GOLD fan¹ Not supported Not supported
BPS + RDIMM or LRDIMM 8 GB RDIMM HPR GOLD fan¹ Not supported
16 GB RDIMM
32 GB RDIMM
64 GB RDIMM
128 GB LRDIMM
256 GB LRDIMM
GPU + ≤128 GB DIMM A100 (max 2) HPR SLVR fan¹ HPR GOLD fan¹ Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
GPU + 256 GB LRDIMM A100 (max 2) HPR GOLD fan¹ Not supported
T4 (max 6) HPR GOLD fan4 Not supported
M10 (max 2) Not supported
A40 (max 2)
GPU + BPS + ≤128 GB DIMM A100 (max 2) HPR GOLD fan4 Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
GPU + BPS + 256 GB LRDIMM A100 (max 2) HPR GOLD fan4 Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
NOTE ¹ for ASHRAE A2 category (35°C), ² for ASHRAE A3 category (40°C), ³ for ASHRAE A4 (45°C) and 4 for ASHRAE A2 category with 30°C ambient temperature restriction.
NOTE Liquid cooling is not supported on rear drive configurations.
NOTE DIMM blank is not required for liquid cooling configurations.
NOTE All the configuration are required to have six fans installed.
NOTE x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without thermal impact.

Other restriction for liquid cooling configurations

  • 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.

Shroud, heat sink, and riser cage restriction

Table 11. Restrictions with shroud, heat sink, and riser cageThe table describes restriction matrix:
PCIe card type Form factor Fan Processor heat sink Shroud Riser cage
GPU FL Configuration dependency T-type (1U-EXT) GPU shroud long
HL short
long
short
long
Non-GPU FL
HL 1U-STD or 2U-HPR STD shroud short

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