Processor family
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Intel Core i5-8250U (Quad Core, 1.6GHz, 6M Cache, 15W)
Intel Core i5-8350U (Quad Core, 1.7GHz, 6M Cache, 15W) vPro
Intel Core i7-8650U (Quad Core, 1.9GHz, 8M Cache, 15W) vPro
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System
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- Chipset—Intel Kaby Lake -U/R—Integrated in the processor
- DRAM bus width— 64 bits
- Flash EPROM— SPI 128 Mbits
- PCIe bus— 100 MHz
- External Bus Frequency— PCIe Gen3 (8 GT/s)
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Operating System
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- Microsoft Windows 10 Home
- Microsoft Windows 10 Pro 64 bit
- Ubuntu
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Memory
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- DDR4 2400 SDRAM operates at 2133 with Intel 7th Gen
- DDR4 2400 SDRAM operates at 2400 with Intel 8th Gen
- One DIMM slot up to 16 GB
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Chipset
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Intel Kaby Lake -U/R—Integrated in the processor
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Video
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- Intel HD Graphics 620 (7th Gen Intel Core)
- Intel UHD Graphics 620 (8th Gen Intel Core)
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Audio
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- Types— Four-channel high-definition audio
- Controller— Realtek ALC3246
- Stereo conversion— 24-bit-analog-to-digital and digital-to-analog
- Internal interface— High-definition audio
- External interface— Microphone-in, stereo headphones, and headset combo connector
- Speakers—Two
- Internal speaker amplifier— 2 W (RMS) per channel
- Volume controls— Hot keys
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Display
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- 12.5 inch HD (1366 x 768) Anti-Glare, HD CAM/Mic, WLAN capable, Mag Alloy back, Non Touch
- 12.5 inch HD (1366 x 768) Anti-Glare, HD CAM/Mic, WLAN/WWAN, Mag Alloy back, Non Touch
- 12.5 inch HD (1366 x 768) Anti-Glare, Mic only, WLAN capable, Mag Alloy back, Non Touch
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Storage options
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Primary Storage:
- 128 GB M.2 2280 SATA SSD
- 256 GB M.2 2280 SATA SSD
- 512 GB M.2 2280 SATA SSD
- 512 GB M.2 2280 SATA SED SSD
- 128 GB M.2 2230 PCIe SSD
- 256 GB M.2 2280 PCIe SSD
- 512 GB M.2 2280 PCIe SSD
- 1 TB M.2 2280 PCIe SSD
- 256 GB M.2 2280 PCIe SED SSD
- 512 GB M.2 2280 PCIe SED SSD
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Security
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TPM 2.0 FIPS 140-2 Certified, TCG Certified (February 2018)
Optional Hardware Authentication Bundle 1: FIPS 201 Contacted Smart Card with Control Vault 2.0 Advanced Authentication with FIPS 140-2 Level 3 Certification
Optional Hardware Authentication Bundle 2: Touch Fingerprint Reader, FIPS 201 Contacted Smart Card, Contactless Smart Card, NFC, Control Vault 2.0 Advanced Authentication with FIPS 140-2 Level 3 Certification
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Docking options
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- Dell Dock WD15 (optional)
- Dell Thunderbolt Dock TB16 (optional on Thunderbolt 3 equipped systems)
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Multimedia
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- Integrated High-Quality Speakers
- Headset and mic combo jack
- Noise reducing array microphones
- Optional HD Cam(0.92 M)
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Optical Drive Options
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External Options Only
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Battery options
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- 3 - Cell, 42 Whr Li-Ion Prismatic, ExpressCharge Capable
- 4 - Cell, 60 Whr Li-Ion Polymer, ExpressCharge Capable
- 4 - Cell, 60 Whr Li-Ion Long Life Cycle (polymer)
42 WHr (3-cell):
- Length—200.5mm (7.89 inch)
- Width—95.9mm ( 3.78 inch)
- Height—5.70mm ( 0.22 inch)
- Weight—185.00 g (0.41lb)
- Voltage—11.4VDC
60 WHr (4-cell):
- Length—238mm (9.37 inch)
- Width—95.9mm ( 3.78 inch)
- Height—5.70mm ( 0.22 inch)
- Weight—270.00 g (0.6lb)
- Voltage—7.6VDC
60 WHr Long Life Cycle polymer battery (4-cell):
- Length—238mm (9.37 inch)
- Width—95.9mm ( 3.78 inch)
- Height—5.70mm ( 0.22 inch)
- Weight—270.00 g (0.6lb)
- Voltage—7.6VDC
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Power adapter
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- Type— E5: 65 W or E5: 90 W
- Input voltage— 100 V AC to 240 V AC
- Input current-maximum— 1.7 A(65 Watt Adapter) and 1.6 A(90 Watt Adapter)
- Input frequency— 50 Hz to 60 Hz
- Output current— 3.34 A and 4.62 A
- Rated output voltage— 19.5 V DC
- Weight— 230 g/0.5 lbs (65 W) and 320 g/0.7 lbs (90 W)
- Dimensions— 22 x 66 x 106 mm/0.87 x 2.60 x 4.17 inch (65 W) and 22 x 66 x 130/0.87 x 2.60 x 5.12 inch (90 W)
- Temperature range-Operating— 0°C to 40°C (32°F to 104°F)
- Temperature range-Non-Operating— -40°C to 70°C (-40°F to 158°F)
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Communications
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Network adapter—10/100/1000 Mb/s Gigabit Ethernet (RJ-45)
Wireless LAN Options:
- No WLAN option
- Qualcomm QCA61x4A 2x2 AC + Bluetooth 4.1 (non vPro)
- Qualcomm QCA6174A XR 2x2 AC + Bluetooth 4.1 (non vPro)
- Intel Dual-Band Wireless-AC 8265 2x2 + Bluetooth 4.2 (non vPro)
Optional Mobile Broadband Options:
- Qualcomm Snapdragon X7 LTE-A (DW5811e) for AT&T, Verizon & Sprint. (US)
- Qualcomm Snapdragon X7 LTE-A (DW5811e) (EMEA/APJ/ROW)
- Qualcomm Snapdragon X7 HSPA + (DW5811e) (China/Indonesia/ India)
- Qualcomm Snapdragon X7 LTE-A (DW5816e) (Japan/ANZ/India/South Korea/Taiwan)
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Ports, Slots, and Chassis
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- HDMI 1.4 (1)
- Universal Jack
- MultiMedia card reader (SD 4.0)
- uSIM (external)
- 2 x USB 3.1 Gen1 (one with PowerShare)
- DisplayPort over USB Type-C (optional Thunderbolt 3 (1)
- RJ45
- Optional Smartcard reader
- Noble lock-Full size
- DC-in
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Camera
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- Type—HD fixed focus
- Sensor type—CMOS sensor technology
- Imaging rate—Up to 30 frames per second
- Video Resolution—1280 x 720 pixels (0.92 MP)
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Touchpad
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Active area
- X-axis—99.50 mm
- Y-axis—53.0 mm
- X/Y position resolution— X: 1048cpi; Y:984cpi
- Multi-touch—Configurable single finger and multi-finger gestures
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Internal Keyboards
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- 12.5 inches Single Pointing, non backlit
- 12.5 inches Single Pointing, backlit (optional)
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Physical specifications
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- Height Front to Back (Non-Touch) —0.65 inches(front and back); 16.53(front), 16.54(back)
- Width—12.00 inch; 304.80 mm
- Depth—8.19 inch; 207.95 mm
- Starting weight— 1.19 kg; 2.63 lbs
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Environmental specifications
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Temperature Specifications
- Operating : 0°C to 35°C (32°F to 95°F)
- Storage : -40°C to 65°C (-40°F to 149°F)
Relative humidity—maximum Specifications
- Operating—10% to 90% (non-condensing)
- Storage— 5% to 95% (non-condensing)
Altitude—maximum Specifications
- Operating: 0 to 3048 m (0 to 10,000 ft) 0°C to 35°C
- Non-operating— 0 to 10668 m
- Airborne contaminant level— G2 or lower as defined by ISA S71.04-1985
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