- Notes, cautions, and warnings
- About this document
- System overview
- Technical specifications
- Chassis dimensions
- System weight
- Processor specifications
- PSU specifications
- Supported operating systems
- Cooling fan specifications
- System battery specifications
- Expansion card riser specifications
- Memory specifications
- Storage controller specifications
- Drives
- Ports and connectors specifications
- Video specifications
- Environmental specifications
- Initial system setup and configuration
- Pre-operating system management applications
- System Setup
- Dell Lifecycle Controller
- Boot Manager
- PXE boot
- Minimum to POST and system management configuration validation
- Installing and removing system components
- Safety instructions
- Before working inside your system
- After working inside your system
- Recommended tools
- Optional front bezel
- System cover
- Drive backplane cover
- Air shrouds
- Removing the air shroud
- Installing the air shroud
- Removing the GPU air shroud top cover
- Installing the GPU air shroud top cover
- Removing the GPU air shroud filler
- Installing the GPU air shroud filler
- Removing the GPU air shroud
- Installing the GPU air shroud
- Removing the 2 x 2.5-inch rear drive module air shroud
- Installing the 2 x 2.5-inch rear drive module air shroud
- Removing the 4 x 2.5-inch rear drive module air shroud
- Installing the 4 x 2.5-inch rear drive module air shroud
- Removing the EDSFF E3.S rear drive module air shroud
- Installing the EDSFF E3.S rear drive module air shroud
- Cooling fans
- Removing the cooling fan cage assembly
- Installing the cooling fan cage assembly
- Removing a cooling fan
- Installing a cooling fan
- Removing a 2 x 2.5-inch rear drive module cooling fan
- Installing a 2 x 2.5-inch rear drive module cooling fan
- Removing a 4 x 2.5-inch rear drive module cooling fan
- Installing a 4 x 2.5-inch rear drive module cooling fan
- Removing the EDSFF E3.S rear drive module cooling fan
- Installing the EDSFF E3.S rear drive module cooling fan
- Drives
- Removing a drive blank
- Installing a drive blank
- Removing a drive carrier
- Installing the drive carrier
- Removing the drive from the drive carrier
- Installing the drive into the drive carrier
- Removing an EDSFF E3.S drive blank
- Installing an EDSFF E3.S drive blank
- Removing an EDSFF E3.S drive carrier
- Installing an EDSFF E3.S drive carrier
- Removing an EDSFF E3.S drive from the drive carrier
- Installing an EDSFF E3.S drive into the drive carrier
- Rear drive module
- Drive backplane
- Side wall brackets
- Cable routings
- PERC module
- EDSFF E3.S backplane module
- System memory
- Processor and heat sink module
- Expansion cards and expansion card risers
- Expansion card installation guidelines
- Removing the expansion card risers
- Installing the expansion card risers
- Removing expansion card from the expansion card riser
- Installing an expansion card into the expansion card riser
- Removing the full length expansion card risers
- Installing the full length expansion card risers
- Removing a GPU
- Installing a GPU
- Removing R1 and R4 paddle cards
- Installing R1 and R4 paddle cards
- Optional serial COM port
- Optional VGA port for Direct Liquid Cooling module
- Optional BOSS-N1 module
- System battery
- Optional internal USB card
- Intrusion switch
- Optional OCP NIC card
- Power supply unit
- Trusted Platform Module
- System board
- LOM card, MIC card and rear I/O board
- Control panel
- Upgrade Kits
- Jumpers and connectors
- System diagnostics and indicator codes
- Getting help
- Documentation resources
Dell PowerEdge R760 Installation and Service Manual
Thermal restriction matrix
| Heat sink | Processor TDP |
|---|---|
| STD HSK | ≤ 165 W (supports only 2.5-inch drives and non-GPU configuration) |
| 2U HPR HSK | 125 W–250 W (supports 3.5-inch drives and non-GPU configuration) |
| 165 W–350 W (supports 2.5-inch drives and non-GPU configuration) | |
| L-type HSK | Supports all GPU/FPGA configurations |
NOTE:All GPU/FGPA cards require 1U L-type HSK and GPU shroud.
| Label | Description |
|---|---|
| STD | Standard |
| HPR (Silver) | High performance Silver (HPR Silver) fan |
| HPR (Gold) | High performance Gold (HPR Gold) fan |
| HSK | Heat sink |
| LP | Low profile |
| FH | Full height |
| DLC | Direct Liquid Cooling |
NOTE:The ambient temperature of the configuration is determined by the critical component in that configuration. For example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is 30°C (86°F), the combined configuration can only support 30°C (86°F).
Thermal restriction matrix for 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch | Ambient temperature | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | ||||
| CPU TDP/cTDP | Cores | T-Case max center (°C) | Fan | HPR GOLD fan 70%^ | ||||||||||
| 3408U | 125 W1 | 8 | 79 | STD | STD | STD | STD | STD | HPR SLVR | STD | HPR GOLD | HPR SLVR | HPR GOLD | 35°C (95°F) |
| 5415+ | 150 W1 | 8 | 78 | STD | STD | STD | STD | STD | HPR SLVR | STD | HPR GOLD | HPR SLVR | HPR GOLD | 35°C (95°F) |
| 4410Y | 12 | 78 | ||||||||||||
| 5416S | 16 | 78 | ||||||||||||
| 5418N | 165 W1 | 24 | 84 | STD | STD | STD | STD | STD | HPR SLVR | STD | HPR GOLD | HPR SLVR | HPR GOLD | 35°C (95°F) |
| 5411N | 24 | 84 | ||||||||||||
| 4416+ | 20 | 82 | ||||||||||||
| 6426Y | 185 W1 | 16 | 72 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 5418Y | 24 | 80 | ||||||||||||
| 5412U | 24 | 80 | ||||||||||||
| 6428N | 32 | 85 | ||||||||||||
| 6421N | 32 | 85 | ||||||||||||
| 6434 | 205 W1 | 8 | 96 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 5420+ | 28 | 84 | ||||||||||||
| 6438Y+ | 32 | 76 | ||||||||||||
| 6438M | 32 | 84 | ||||||||||||
| 6438N | 32 | 84 | ||||||||||||
| 6442Y | 225 W1 | 24 | 79 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD* | HPR GOLD* | 35°C (95°F) |
| 6448Y | 32 | 79 | ||||||||||||
| 6444Y | 270 W2 | 32 | 75 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 8462Y+ | 300 W2 | 32 | 81 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR fan | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 6458Q | 350 W2 | 32 | 64 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | 35°C (95°F) |
| 6414U | 250 W2 | 32 | 76 | STD fan | STD fan | STD fan | STD fan | STD fan | HPR SLVR fan | HPR SLVR | HPR GOLD | HPR GOLD* | HPR GOLD* | 35°C (95°F) |
| 6454S | 270 W2 | 32 | 71 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR fan | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 6430 | 32 | 71 | ||||||||||||
| 8471N | 300 W2 | 52 | 76 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 8470N | 52 | 76 | ||||||||||||
| 8460Y+ | 40 | 75 | ||||||||||||
| 8452Y | 36 | 75 | ||||||||||||
| 8480+ | 350 W2 | 56 | 79 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD* | Required DLC | Required DLC | 35°C (95°F) |
| 8470 | 52 | 79 | ||||||||||||
| 8468 | 48 | 79 | ||||||||||||
| 8470Q | 350 W2 | 52 | 57 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | 35°C (95°F) |
| 9480 | 350 W2 | 56 | 64 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | 35°C (95°F) |
| 9470 | 52 | 64 | ||||||||||||
| 9460 | 350 W2 | 40 | 77 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD* | Required DLC | Required DLC | 35°C (95°F) |
| 9462 | 32 | 77 | ||||||||||||
NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
- 1 supports MS system board (CPU TDP < 250 W)
- 2 supports MAX system board (CPU TDP => 250 W)
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
NOTE:*Supported ambient temperature is 30°C (86°F).
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch | |||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | |
| DIMM Configuration | 2DPC/Power | STD fan (CPU TDP <= 250 W) | HPR SLVR fan (CPU TDP up to 350 W) | STD fan (CPU TDP <= 165 W) | HPR GOLD fan (CPU TDP up to 350 W) | HPR SLVR fan 70% (CPU TDP up to 165 W)^ | |||||
| 256 GB RDIMM | 12.7 W | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 35°C (95°F) | Required DLC | 35°C (95°F) | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| DIMM Configuration | 2DPC/Power | HPR SLVR fan (CPU TDP up to 350 W) | HPR GOLD fan (CPU TDP up to 350 W) | HPR GOLD fan 70% (CPU TDP up to 250 W) | |||||||
| 256 GB RDIMM | 12.7 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
NOTE:In 12 x 3.5-inch with rear module configuration, for CPU TDP greater than 270 W and specific Low Temperature-case CPUs are not supported.
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
| Configuration | 24 x 2.5-inch SAS | 12 x 3.5-inch | ||||
|---|---|---|---|---|---|---|
| Rear storage | 2 x 2.5-inch with rear fan | 4 x 2.5-inch with rear fan | 2 x 2.5-inch with rear fan | 4 x 2.5-inch with rear fan | ||
| Drive type | Drives capacity | Power | HPR SLVR fan | HPR GOLD fan 70% | ||
| Kioxia CD7 | 15.36 TB | 19 W | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| Samsung PM9A3 | 7.68 TB | 14 W | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| Samsung PM1733 | 15.36 TB | 22 W | 30°C (86°F) | 30°C (86°F) | N/A | N/A |
| Samsung PM1733a | 15.36 TB | 19.7 W | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | N/A |
| Samsung PM1735a | 12.8 TB | 19.8 W | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | N/A |
| Redtail | 7.68 TB | 24.5 W | 30°C (86°F) | 30°C (86°F) | N/A | N/A |
| Hynix PE8010 | 7.68/3.84/1.92 TB | 17 W | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | N/A |
| Intel P5520 | 15.36 TB | 20 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| Kioxia CM7 | 30.72 TB | 25 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| Kioxia CD8 | 15.36 TB | 19 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| PE8110 | 7.68 TB | 20 W | 30°C (86°F) | N/A | N/A | N/A |
| PE8110 | 3.84/1.92 TB | 20 W | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | N/A |
| PS1010 | 15.36 TB | 20 W | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| PS1030 | 12.8 TB | 20 W | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| Configuration | No backplane | 8 x 2.5-inch NVMe | 8 x 2.5-inch NVMe + 8 x 2.5-inch SAS | 16 x 2.5-inch SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | |||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | |||
| CPU TDP/cTDP | Cores | T-Case max center (°C) | HPR GOLD fan with 1U HPR L-Type HSK | ||||||||
| 3408U | 125 W 1 | 8 | 79 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 5415+ | 150 W 1 | 8 | 78 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 4410Y | 12 | 78 | |||||||||
| 5416S | 16 | 78 | |||||||||
| 5418N | 165 W 1 | 24 | 84 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 5411N | 24 | 84 | |||||||||
| 4416+ | 20 | 82 | |||||||||
| 6426Y | 185 W 1 | 16 | 72 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 5418Y | 24 | 80 | |||||||||
| 5412U | 24 | 80 | |||||||||
| 6428N | 32 | 85 | |||||||||
| 6421N | 32 | 85 | |||||||||
| 6434 | 205 W 1 | 8 | 96 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (86°F) | 30°C (86°F) |
| 5420+ | 28 | 84 | |||||||||
| 6438Y+ | 32 | 76 | |||||||||
| 6438M | 32 | 84 | |||||||||
| 6438N | 32 | 84 | |||||||||
| 6442Y | 225 W 1 | 24 | 79 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 6448Y | 32 | 79 | |||||||||
| 6444Y | 270 W 2 | 32 | 75 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 8462Y+ | 300 W 2 | 32 | 81 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) |
| 6458Q | 350 W 2 | 32 | 64 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC |
| 6414U | 250 W 2 | 32 | 76 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 6454S | 270 W 2 | 32 | 71 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) |
| 6430 | 32 | 71 | |||||||||
| 8471N | 300 W 2 | 52 | 76 | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) |
| 8470N | 52 | 76 | |||||||||
| 8460Y+ | 40 | 75 | |||||||||
| 8452Y | 36 | 75 | |||||||||
| 8480+ | 350 W 2 | 56 | 79 | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | Required DLC | Required DLC | Required DLC |
| 8470 | 52 | 79 | |||||||||
| 8468 | 48 | 79 | |||||||||
| 8470Q | 350 W 2 | 52 | 57 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC |
| 9480 | 350 W 2 | 56 | 64 | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC | Required DLC |
| 9470 | 52 | 64 | |||||||||
| 9460 | 350 W 2 | 40 | 77 | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | Required DLC | Required DLC | Required DLC |
| 9462 | 32 | 77 | |||||||||
NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
- 1 supports MS system board (CPU TDP < 250 W)
- 2 supports MAX system board (CPU TDP => 250 W)
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
NOTE:*Supported ambient temperature is 30°C (86°F).
NOTE:GPU configuration supports only High performance Gold (HPR Gold) fan.
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS * | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe ** | 24 x 2.5-inch SAS* | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe*** | 24 x 2.5-inch NVMe*** | |
|---|---|---|---|---|---|---|---|---|
| DIMM Configuration | 2DPC/Power | HPR GOLD fan with 1U HPR L-Type HSK | ||||||
| 256 GB RDIMM | 12.7 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | Required DLC | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
NOTE:*In 16 x 2.5-inch SAS and 8 x 2.5-inch NVMe configurations, for CPU TDP 350 W supported ambient temperature is 30°C (86°F).
NOTE:**In 16 x 2.5-inch NVMe configuration, for CPU TDP greater than 300 W supported ambient temperature is 30°C (86°F).
NOTE:***In 24 x 2.5-inch SAS/NVMe configuration and 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe, for CPU TDP 270 W - 300 W and specific Low Temperature-case CPUs supported ambient temperature is 30°C (86°F).
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch | Ambient temperature | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch rear drives with rear fan | EDSFF E3.S rear drives with rear fan | ||||
| CPU TDP/cTDP | Cores | T-Case max center (°C) | Fan/HSK | HPR GOLD fan 70%^ | |||||||||||
| 5415+ | 150 W | 8 | 78 | STD /2U HPR | STD /2U HPR | STD /2U HPR | STD /2U HPR | STD /2U HPR | HPR SLVR /2U HPR | STD /2U HPR | HPR GOLD /STD | HPR SLVR /2U HPR | HPR GOLD /2U HPR | HPR SLVR /2U HPR | 35°C (95°F) |
| 4410Y | 12 | 78 | |||||||||||||
| 5416S | 16 | 78 | |||||||||||||
| 5418N/5411N | 165 W | 24 | 84 | STD /2U HPR | STD /2U HPR | STD /2U HPR | STD /2U HPR | STD /2U HPR | HPR SLVR /2U HPR | STD /2U HPR | HPR GOLD /STD | HPR SLVR /2U HPR | HPR GOLD /2U HPR | HPR SLVR /2U HPR | 35°C (95°F) |
| 4416+ | 20 | 82 | |||||||||||||
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
Thermal restriction matrix for 5th Gen Intel® Xeon® Scalable Processors
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch^ | Ambient temperature | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | ||||
| CPU TDP/cTDP | Cores | T-Case max center (°C) | Fan | |||||||||||
| 4509Y | 125 W1 | 8 | 84 | STD | STD | STD | STD | STD | HPR SLVR | STD | HPR GOLD | HPR SLVR | HPR GOLD | 35°C (95°F) |
| 4510 | 150 W1 | 12 | 84 | STD | STD | STD | STD | STD | HPR SLVR | STD | HPR GOLD | HPR SLVR | HPR GOLD | 35°C (95°F) |
| 4514Y | 16 | 79 | ||||||||||||
| 5512U | 185 W1 | 28 | 89 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 6534 | 195 W1 | 8 | 64 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 6526Y | 16 | 82 | ||||||||||||
| 6542Y | 250 W1 | 24 | 83 | STD | STD | STD | STD | STD | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD* | HPR GOLD* | 35°C (95°F) |
| 6548Y+ | 32 | 83 | ||||||||||||
| 6548N | 32 | 83 | ||||||||||||
| 8562Y+ | 300 W 2 | 32 | 81 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 8558U | 300 W 2 | 48 | 78 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD | Required DLC | Required DLC | 35°C (95°F) |
| 8568Y+ | 350 W 2 | 48 | 81 | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR fan | HPR SLVR fan | HPR GOLD* | Required DLC | Required DLC | 35°C (95°F) |
| 8580 | 60 | 81 | ||||||||||||
| 8592+ | 64 | 81 | ||||||||||||
NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
- 1 supports MS system board (CPU TDP < 250 W)
- 2 supports MAX system board (CPU TDP ≥ 250 W)
NOTE:*Supported ambient temperature is 30°C (86°F).
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch | |||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | |
| DIMM Configuration | 2DPC/Power | STD fan (CPU TDP <= 250 W) | HPR SLVR fan (CPU TDP up to 350 W) | STD fan (CPU TDP <= 165 W) | HPR GOLD fan (CPU TDP up to 350 W) | HPR SLVR fan 70% (CPU TDP up to 165 W)^ | |||||
| 256 GB RDIMM* | 12.7 W | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 35°C (95°F) | Required DLC | 35°C (95°F) | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 96 GB RDIMM | 8.3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| DIMM Configuration | 2DPC/Power | HPR SLVR fan (CPU TDP up to 350 W) | HPR GOLD fan (CPU TDP up to 350 W) | HPR GOLD fan 70% (CPU TDP up to 250 W)^ | |||||||
| 256 GB RDIMM* | 12.7 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 96 GB RDIMM | 8.3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
NOTE:*256 GB RDIMM with
5th Gen Intel® Xeon® Scalable Processors will be supported in the future release.
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | ||||
| CPU TDP/cTDP | Cores | T-Case max center (°C) | Support HPR GOLD fan with 1U HPR L-Type HSK | ||||||||
| 4509Y | 125 W1 | 8 | 84 | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | |
| 4510 | 150 W1 | 12 | 84 | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | |
| 4514Y | 16 | 79 | |||||||||
| 5512U | 185 W1 | 28 | 89 | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | |
| 6534 | 195 W1 | 8 | 64 | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | |
| 6526Y | 16 | 82 | |||||||||
| 6542Y | 250 W1 | 24 | 83 | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | 35°C | |
| 6548Y+ | 32 | 83 | |||||||||
| 6548N | 32 | 83 | |||||||||
| 8562Y+ | 300 W 2 | 32 | 81 | 35°C | 35°C | 35°C | 35°C | 30°C | 30°C | 30°C | |
| 8558U | 300 W 2 | 48 | 78 | 35°C | 35°C | 35°C | 35°C | 30°C | 30°C | 30°C | |
| 8568Y+ | 350 W 2 | 48 | 81 | 30°C | 30°C | 30°C | 30°C | Required DLC | Required DLC | Required DLC | |
| 8580 | 60 | 81 | |||||||||
| 8592+ | 64 | 81 | |||||||||
NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
- 1 supports MS system board (CPU TDP < 250 W)
- 2 supports MAX system board (CPU TDP ≥ 250 W)
NOTE:*Supported ambient temperature is 30°C (86°F).
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | |
|---|---|---|---|---|---|---|---|---|
| DIMM Configuration | 2DPC/Power | HPR GOLD fan with 1U HPR L-Type HSK | ||||||
| 256 GB RDIMM* | 12.7 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | Required DLC | Required DLC | Required DLC |
| 128 GB RDIMM | 8.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 96 GB RDIMM | 8.3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 64 GB RDIMM | 6.9 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 32 GB RDIMM | 4.1 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| 16 GB RDIMM | 3 W | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
NOTE:*256 GB RDIMM with
5th Gen Intel® Xeon® Scalable Processors will be supported in the future release.
Common thermal restrictions for both 4th and 5th Gen Intel processors
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and split NVMe-SAS | 16 x 2.5-inch NVMe or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe |
|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives |
| GPU | HPR GOLD fan with 1U HPR L-Type HSK | ||||||
| A40 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) |
| Intel PVC (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 30°C (86°F) | 30°C (86°F) | 30°C (86°F) |
| A100 80 GB (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| A16 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| A30 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| A2 (Max 6) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| H100 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| A800 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| L4 (Max 6) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| L40 (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| Intel ASM (Max 6) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| L40S (Max 2) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) | 35°C (95°F) |
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | 12 x 3.5-inch^ | Ambient temperature | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | No rear drives | No rear drives | No rear drives | 2.5-inch or EDSFF E3.S rear drives with rear fan | ||
| DIMM Configuration | Power | Fan | ||||||||||
| 256 GB RDIMM* | 12.7 W | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR SLVR | HPR GOLD | HPR GOLD fan | 35°C (95°F) |
| 128 GB RDIMM | 8.9 W | STD | STD | STD | STD | STD | STD | STD | STD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 96 GB RDIMM | 8.3 W | STD | STD | STD | STD | STD | STD | STD | STD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 64 GB RDIMM | 6.9 W | STD | STD | STD | STD | STD | STD | STD | STD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 32 GB RDIMM | 4.1 W | STD | STD | STD | STD | STD | STD | STD | STD | HPR GOLD | HPR GOLD | 35°C (95°F) |
| 16 GB RDIMM | 3 W | STD | STD | STD | STD | STD | STD | STD | STD | HPR GOLD | HPR GOLD | 35°C (95°F) |
NOTE:^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.
NOTE:*256 GB RDIMM with
5th Gen Intel® Xeon® Scalable Processors will be supported in the future release.
| Configuration | No backplane | 8 x 2.5-inch NVMe | 16 x 2.5-inch SAS and Split NVMe-SAS | 16 x 2.5-inch or 16 x EDSFF E3.S NVMe | 24 x 2.5-inch SAS | 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe | 24 x 2.5-inch NVMe | Ambient temperature | |||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Rear storage | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | No rear drives | ||||
| DIMM Configuration | Power | Fan | |||||||||
| 256 GB RDIMM* | 12.7 W | HPR GOLD fan | 35°C (95°F) | ||||||||
| 128 GB RDIMM | 8.9 W | ||||||||||
| 96 GB RDIMM | 8.3 W | ||||||||||
| 64 GB RDIMM | 6.9 W | ||||||||||
| 32 GB RDIMM | 4.1 W | ||||||||||
| 16 GB RDIMM | 3 W | ||||||||||
NOTE:*256 GB RDIMM with
5th Gen Intel® Xeon® Scalable Processors will be supported in the future release.
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