AI is reshaping data centers. Compute density is accelerating. Power and cooling are now first-class design must-haves. Open standards have moved from optional to essential.
At OCP Summit 2025, Dell showcases how we’re leading with open, efficient designs that deliver at-scale, flexible AI solutions for enterprises. Our latest integrated rack-scale system, the Dell IR7000 rack, is proof of how Dell has embraced OCP standards to deliver cutting-edge, production-ready systems primed and ready to handle the most challenging AI demands.
We’re demonstrating how Dell transforms open designs into enterprise-ready infrastructure to show how openness can be delivered, supported, and scaled at enterprise level:
Turnkey solutions with rack-scale systems for faster time-to- value
AI-ready, scalable, and easy to deploy and manage, Dell’s Integrated Rack-scale systems (IRSS) provide turnkey rack-scale solutions that are integrated, tested, and validated so customers can save months of time and be ready to go and operate, faster:
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- Open and modular: aligned to OCP standards, including Open Rack V3, DC-MHS).
- Faster deployment and reduced integration risk: with factory-validation to ensure seamless implementation.
- Single vendor support: full rack support backed by Dell, with optional data center assessment.
- Future proof and lifecycle-ready: Dell IR7000 Orv3-based racks include multi-generational Dell DLC manifolds and the ability to support future generations of compute sleds with up to 480kW of power.
- Unparalleled simplicity: with a patented AC whip design, a 750mm-wide form factor, and a strain relief bar to simplify cable management and support.
- Deliver the latest GPUs for extreme performance: Dell has extended the Orv3 design to support 19” rack sleds with the bespoke Dell Integrated Rack 9000 (IR9000) series, engineered for systems like the PowerEdge XE9712 with NVIDIA GB300 NVL72 GPUs that demand larger racks and extreme performance.
Save up to 60% on cooling costs with PowerCool eRDHx—more than cooling; it’s how to run more AI and HPC compute in the same footprint with greater efficiency.
High-density compute brings with it skyrocketing thermal loads. The PowerCool Rear-Door Heat Exchanger (eRDHx) delivers a new category of innovative, integrated cooling:
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- Operate at room-neutral temperatures: Advanced heat-capture technology neutralizes 100% of IT heat enabling operation at room temperatures.
- Reduce cooling energy costs by up to 60% when combined with Dell IR7000 racks with integrated hybrid Direct Liquid Cooling (DLC).
- Cut energy costs and reduce reliance on chillers: operates at warmer water temperatures (32–36 °C), and eliminate the need for expensive chillers.
- Monitor, manage, and act fast with centralized rack management: The Dell Integrated Rack Controller (IRC), with OpenManage Enterprise (OME), manages the enclosed rear-door heat exchanger (eRDHx). Together, they deliver centralized, real-time rack-level monitoring, provide data-driven cooling insights that improve efficiency, and enhance risk mitigation.
Optimized for lower power, cost, and latency, Dell Linear Pluggable Optics (LPO) is a Digital Signal Processor-free optical solution for modern networking. Dell LPO eliminates the Digital Signal Processor (DSP) chip, using the host platform’s DSP instead. The results include:
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- Lower power draw and 50% lower consumption: 2–4W for 400GbE vs. 7–9W for traditional optics, and up to 50% lower transceiver power consumption.
- Lower cost: LPOs eliminate the DSP chip, lowering costs for hyperscale GenAI and boosting supply options.
- Lower latency: Optimized for real-time AI and HPC workloads.
Integrated with Dell PowerSwitch Ethernet and Broadcom Thor 2 NICs, LPO supports 400GbE and 800GbE, allowing for gradual adoption.
Dell is committed to delivering open standards-based infrastructure, making it enterprise-ready to deliver value to our customers.
The OCP community thrives on open design. Dell brings that into practice with:
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- Open, modular hardware aligned with standards.
- Proven cooling innovations for AI density.
- Global scale and enterprise support to ensure success.
Open standards matter. Efficiency matters. Time-to-value matters. With Dell’s latest innovations in rackscale, power and cooling with PowerCool eRDHx, and Networking with LPO, Dell shows at OCP Summit 2025 that customers don’t have to choose—they can have all three, delivered today.
