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Dell PowerEdge R660 Installation and Service Manual

Thermal restriction matrix

Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HSK > 185 W
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label Description
STD Standard
HPR (Gold) High performance (gold grade)
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling
Table 3. Thermal restriction matrix for air cooled configurationThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10 x 2.5-inch SAS/SATA 10 x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S Ambient temperature
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch No Rear Drives 2 x EDSFF E3.S
CPU TDP/cTDP T-Case max center (°C) Fan
125 W 79 (174.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
150 W 78 (172.4°F)/79 (174.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
165 W 82 (179.6°F)/84 (183.2°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
185 W 80 (176°F)/81 (177.8°F)/85 (185°F) STD fan STD fan STD fan HPR Gold fan STD fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
195 W 64 (147.2°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
205 W 76 (168.8°F)/84 (183.2°F)/85 (185°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
225 W 79 (174.2°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
250 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan 35°C (95°F)
270 W 75 (167°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* 35°C (95°F)
270 W 71 (159.8°F) HPR Gold fan HPR Gold fan HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* HPR Gold fan HPR Gold fan* 35°C (95°F)
300 W 81 (177.8°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 77 (170.6°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 75 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
300 W 76 (172.4°F) HPR Gold fan HPR Gold fan HPR Gold fan* Required DLC HPR Gold fan* Required DLC HPR Gold fan* Required DLC 35°C (95°F)
350 W 79 (174.2°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 57 (134.6°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 66 (150.8°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 77/79 (170.6/174.2°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 77/77 (170.6/170.6°F) HPR Gold fan* HPR Gold fan* Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 64/77 (147.2/170.6°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
350 W 64/76 (147.2/168.8°F) Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC Required DLC 35°C (95°F)
NOTE:
  • *Supported ambient temperature is 30°C (86°F) .
  • Required DLC requires <30°C (86°F)

Thermal restriction matrix for 5th Gen Intel® Xeon® Scalable Processors

Table 4. Thermal restriction matrix for air cooled configurationThe table describes the thermal restriction matrix:
Front Configuration No BP SAS/ SATA 8x2.5"(Smart Flow) NVMe/ 10x2.5" SAS/SATA 10x2.5" NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
-Rear Configuration 3xLP/ 2xFH 2xLP/ 3xLP/ 2xFH 3xLP/2xFH Rear 2x2.5"SAS/SATA 3xLP 3xLP/2xFH Rear 2x2.5"NVMe Rear 2xE3 3xLP/ 2xFH 3xLP/2xFH 2 x EDSFF E3.S
Any (RC0, RC1, RC2, RC3) Any Non- Rear 2x2.5" (RC0, RC1, RC2, RC3) Rear 2x2.5" (RC7) Any (RC1) Non- Rear 2x2.5" (RC0, RC1, RC2, RC3) Rear 2x2.5" (RC7) Rear E3 (RC9) Any (RC0,RC1,RC2,RC3.RC10) Non- Rear 2x2.5" (RC0,RC0,RC1,RC2,RC3, Rear E3 (RC9)
TDP Core Count Tcase Spec DIMM<=128 GB DIMM<=128 GB Tcase Spec
125 W1 8 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
150 W1 12 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
150 W1 16 79 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
185 W1 28 89 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
195 W1 8 64 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
195 W1 16 82 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 24 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 32 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
250 W1 32 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
300 W 2 32 81 35°C 35°C 30°C N/A N/A 30°C N/A N/A N/A 30°C N/A
270 W 2 60 74 35°C 35°C 35°C 30°C 30°C 35°C 30°C 30°C 30°C 35°C 30°C
300 W 2 48 78 35°C 35°C 30°C N/A N/A 30°C N/A N/A N/A 30°C N/A
350 W 2 48 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
350 W 2 60 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
350 W 2 64 81 30°C 30°C N/A N/A N/A N/A N/A N/A N/A N/A N/A
Table 5. Thermal restriction for memoryThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10x 2.5-inch SAS/SATA 10x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch No Rear Drives 2 x EDSFF E3.S
256 GB RDIMM 35°C (95°F) 35°C (95°F) 30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
35°C (95°F) 35°C (95°F)
NOTE:
  • Install all fan modules for single CPU configuration.
    NOTE: Not required for 8 x 2.5-inch NVMe /SAS/SATA configuration.
  • All air-cooling configurations require a CPU shroud.
  • Install PCH shroud for no riser configuration.
  • Install Rear drive shroud for air-cooling with 2 x 2.5-inch rear drive configuration.
  • Install A2 blank on R1p riser for FH riser configuration with A2 GPU.
  • Install DIMM blanks in all empty DIMM slots for STD CPU heat sink or CPU TDP >=250W.
Table 6. Thermal restriction for L4 GPUThe table describes thermal restriction matrix:
Configuration No Backplane 8 x 2.5-inch NVMe /SAS/SATA 10x 2.5-inch SAS/SATA 10x 2.5-inch SAS/SATA 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 10 x 2.5-inch NVMe 16 x EDSFF E3.S 14 x EDSFF E3.S
Rear storage No Rear Drives No Rear Drives No Rear Drives 2 x 2.5-inch No Rear Drives 2 x 2.5-inch 2 x EDSFF E3.S No Rear Drives 2 x EDSFF E3.S
L4 GPU CPU>270 W not supported CPU>270 W not supported CPU>225 W not supported CPU>205 W not supported CPU>225 W not supported CPU>205 W not supported CPU>225 W not supported CPU>225 W not supported CPU>205 W not supported
NOTE:
  • Installation of the GPU blank is necessary for the FH riser configuration (RC3) with an LP GPU card on R1P in order to stop the system's airflow.
  • No additional thermal restriction to support in R1p+R4p (2x FHs) and R2q riser.
  • For 3x LPs configuration, no additional thermal restriction to support 2x L4 GPUs in slot 1 and slot 2, and non-GPU card in slot 3.
  • For 3x LPs configuration with 3x L4 GPU cards, it requires additional CPU SKUs to support restriction.
  • For No BP and 8 x 2.5 inch configurations, CPU TDP higher than 270 W are not supported with 3x L4 GPUs.
  • For 10x2.5 inch and 16 x EDSFF E3.S configurations, CPU TDP higher than 225 W are not supported with 3x L4 GPUs.
  • For 10x2.5 inch and 16 x EDSFF E3.S configurations with rear drive configurations, CPU TDP higher than 205W are not supported.

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