Thermal restriction matrix
Table 1. Processor and heat sink matrixThis table describes the processor and heat sink restriction matrix.
Heat sink
|
Processor TDP
|
STD HSK
|
≤ 185 W
|
L-type HSK
|
> 185 W
|
Table 2. Label referenceThis table describes the label references used in the restriction tables.
Label
|
Description
|
STD
|
Standard
|
HPR (Gold)
|
High performance (gold grade)
|
HSK
|
Heat sink
|
LP
|
Low profile
|
FH
|
Full height
|
DLC
|
Direct Liquid Cooling
|
Table 3. Thermal restriction matrix for air cooled configurationThe table describes thermal restriction matrix:
Configuration
|
No Backplane
|
8 x 2.5-inch NVMe /SAS/SATA
|
10 x 2.5-inch SAS/SATA
|
10 x 2.5-inch SAS/SATA
|
10 x 2.5-inch NVMe
|
10 x 2.5-inch NVMe
|
16 x EDSFF E3.S
|
14 x EDSFF E3.S
|
Ambient temperature
|
Rear storage
|
No Rear Drives
|
No Rear Drives
|
No Rear Drives
|
2 x 2.5-inch
|
No Rear Drives
|
2 x 2.5-inch
|
No Rear Drives
|
2 x EDSFF E3.S
|
CPU TDP/cTDP
|
T-Case max center (°C)
|
Fan
|
125 W
|
79 (174.2°F)
|
STD fan
|
STD fan
|
STD fan
|
HPR Gold fan
|
STD fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
150 W
|
78 (172.4°F)/79 (174.2°F)
|
STD fan
|
STD fan
|
STD fan
|
HPR Gold fan
|
STD fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
165 W
|
82 (179.6°F)/84 (183.2°F)
|
STD fan
|
STD fan
|
STD fan
|
HPR Gold fan
|
STD fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
185 W
|
80 (176°F)/81 (177.8°F)/85 (185°F)
|
STD fan
|
STD fan
|
STD fan
|
HPR Gold fan
|
STD fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
195 W
|
64 (147.2°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
205 W
|
76 (168.8°F)/84 (183.2°F)/85 (185°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
225 W
|
79 (174.2°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
250 W
|
76 (172.4°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
35°C (95°F)
|
270 W
|
75 (167°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
HPR Gold fan
|
HPR Gold fan*
|
HPR Gold fan
|
HPR Gold fan*
|
35°C (95°F)
|
270 W
|
71 (159.8°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
HPR Gold fan
|
HPR Gold fan*
|
HPR Gold fan
|
HPR Gold fan*
|
35°C (95°F)
|
300 W
|
81 (177.8°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
35°C (95°F)
|
300 W
|
76 (172.4°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
35°C (95°F)
|
300 W
|
77 (170.6°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
35°C (95°F)
|
300 W
|
75 (172.4°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
35°C (95°F)
|
300 W
|
76 (172.4°F)
|
HPR Gold fan
|
HPR Gold fan
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
HPR Gold fan*
|
Required DLC
|
35°C (95°F)
|
350 W
|
79 (174.2°F)
|
HPR Gold fan*
|
HPR Gold fan*
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
57 (134.6°F)
|
HPR Gold fan*
|
HPR Gold fan*
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
66 (150.8°F)
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
77/79 (170.6/174.2°F)
|
HPR Gold fan*
|
HPR Gold fan*
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
77/77 (170.6/170.6°F)
|
HPR Gold fan*
|
HPR Gold fan*
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
64/77 (147.2/170.6°F)
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
350 W
|
64/76 (147.2/168.8°F)
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
Required DLC
|
35°C (95°F)
|
NOTE:
- *Supported ambient temperature is 30°C (86°F) .
- Required DLC requires <30°C (86°F)
Thermal restriction matrix for 5th Gen Intel® Xeon® Scalable Processors
Table 4. Thermal restriction matrix for air cooled configurationThe table describes the thermal restriction matrix:
Front Configuration
|
No BP
|
SAS/ SATA 8x2.5"(Smart Flow) NVMe/
|
10x2.5" SAS/SATA
|
10x2.5" NVMe
|
16 x EDSFF E3.S
|
14 x EDSFF E3.S
|
-Rear Configuration
|
3xLP/ 2xFH
|
2xLP/ 3xLP/ 2xFH
|
3xLP/2xFH
|
Rear 2x2.5"SAS/SATA
|
3xLP
|
3xLP/2xFH
|
Rear 2x2.5"NVMe
|
Rear 2xE3
|
3xLP/ 2xFH
|
3xLP/2xFH
|
2 x EDSFF E3.S
|
Any (RC0, RC1, RC2, RC3)
|
Any
|
Non- Rear 2x2.5" (RC0, RC1, RC2, RC3)
|
Rear 2x2.5" (RC7)
|
Any (RC1)
|
Non- Rear 2x2.5" (RC0, RC1, RC2, RC3)
|
Rear 2x2.5" (RC7)
|
Rear E3 (RC9)
|
Any (RC0,RC1,RC2,RC3.RC10)
|
Non- Rear 2x2.5" (RC0,RC0,RC1,RC2,RC3,
|
Rear E3 (RC9)
|
TDP
|
Core Count
|
Tcase Spec
|
DIMM<=128 GB
|
DIMM<=128 GB Tcase Spec
|
125 W1
|
8
|
84
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
150 W1
|
12
|
84
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
150 W1
|
16
|
79
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
185 W1
|
28
|
89
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
195 W1
|
8
|
64
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
195 W1
|
16
|
82
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
250 W1
|
24
|
83
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
250 W1
|
32
|
83
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
250 W1
|
32
|
83
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
35°C
|
300 W
2
|
32
|
81
|
35°C
|
35°C
|
30°C
|
N/A
|
N/A
|
30°C
|
N/A
|
N/A
|
N/A
|
30°C
|
N/A
|
270 W
2
|
60
|
74
|
35°C
|
35°C
|
35°C
|
30°C
|
30°C
|
35°C
|
30°C
|
30°C
|
30°C
|
35°C
|
30°C
|
300 W
2
|
48
|
78
|
35°C
|
35°C
|
30°C
|
N/A
|
N/A
|
30°C
|
N/A
|
N/A
|
N/A
|
30°C
|
N/A
|
350 W
2
|
48
|
81
|
30°C
|
30°C
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
350 W
2
|
60
|
81
|
30°C
|
30°C
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
350 W
2
|
64
|
81
|
30°C
|
30°C
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
Table 5. Thermal restriction for memoryThe table describes thermal restriction matrix:
Configuration
|
No Backplane
|
8 x 2.5-inch NVMe /SAS/SATA
|
10x 2.5-inch SAS/SATA
|
10x 2.5-inch SAS/SATA
|
10 x 2.5-inch NVMe
|
10 x 2.5-inch NVMe
|
16 x EDSFF E3.S
|
14 x EDSFF E3.S
|
Rear storage
|
No Rear Drives
|
No Rear Drives
|
No Rear Drives
|
2 x 2.5-inch
|
No Rear Drives
|
2 x 2.5-inch
|
No Rear Drives
|
2 x EDSFF E3.S
|
256 GB RDIMM
|
35°C (95°F)
|
35°C (95°F)
|
30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
|
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
|
30°C (86°F)
NOTE: 30°C (86°F) for CPU>250W (CPU<=250W could support 35°C (95°F) )
|
30°C (86°F)
NOTE: 30°C (86°F) for CPU>225W (CPU<=225W could support 35°C (95°F) )
|
35°C (95°F)
|
35°C (95°F)
|
Table 6. Thermal restriction for L4 GPUThe table describes thermal restriction matrix:
Configuration
|
No Backplane
|
8 x 2.5-inch NVMe /SAS/SATA
|
10x 2.5-inch SAS/SATA
|
10x 2.5-inch SAS/SATA
|
10 x 2.5-inch NVMe
|
10 x 2.5-inch NVMe
|
10 x 2.5-inch NVMe
|
16 x EDSFF E3.S
|
14 x EDSFF E3.S
|
Rear storage
|
No Rear Drives
|
No Rear Drives
|
No Rear Drives
|
2 x 2.5-inch
|
No Rear Drives
|
2 x 2.5-inch
|
2 x EDSFF E3.S
|
No Rear Drives
|
2 x EDSFF E3.S
|
L4 GPU
|
CPU>270 W not supported
|
CPU>270 W not supported
|
CPU>225 W not supported
|
CPU>205 W not supported
|
CPU>225 W not supported
|
CPU>205 W not supported
|
CPU>225 W not supported
|
CPU>225 W not supported
|
CPU>205 W not supported
|
NOTE:
- Installation of the GPU blank is necessary for the FH riser configuration (RC3) with an LP GPU card on R1P in order to stop the system's airflow.
- No additional thermal restriction to support in R1p+R4p (2x FHs) and R2q riser.
- For 3x LPs configuration, no additional thermal restriction to support 2x L4 GPUs in slot 1 and slot 2, and non-GPU card in slot 3.
- For 3x LPs configuration with 3x L4 GPU cards, it requires additional CPU SKUs to support restriction.
- For No BP and 8 x 2.5 inch configurations, CPU TDP higher than 270 W are not supported with 3x L4 GPUs.
- For 10x2.5 inch and 16 x EDSFF E3.S configurations, CPU TDP higher than 225 W are not supported with 3x L4 GPUs.
- For 10x2.5 inch and 16 x EDSFF E3.S configurations with rear drive configurations, CPU TDP higher than 205W are not supported.